Semiconductor device

ABSTRACT

Provided is a semiconductor device making it possible to promote area reduction while maintaining ESD resistance. The semiconductor device includes a power wire, a ground wire and a protection circuit provided between the power wire and the ground wire so as to cope with electrostatic discharge. The protection circuit includes a first transistor, a first resistive element, a second transistor, a first capacitive element, a first inverter and a protection transistor. Agate width of the second transistor is narrower than a gate width of the first transistor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/865,418 filed Sep. 25, 2015, which claims priority from JapanesePatent Application No. 2014-198264 filed on Sep. 29, 2014, thedisclosures of which are incorporated by reference herein in theirentirety.

BACKGROUND

The present disclosure relates to a semicondcutor device, and, inparticular, relates to the semiconductor device which includes an ESD(Electro Static Discharge) protection element.

In recent years, there has been demanded a multi-pin semiconductordevice which includes I/C pins (input/output pins) of the numberexceeding thousands with advancement of function and performance of thesemiconductor device. Accordingly, an area of each I/O block has come togreatly influence reductions in size and cost of the entiresemiconductor device. As examples of an element which is large in ratiothat the area of each I/O block occupies, an electrostatic dischargeprotection element (ESD protection element) and a driver element of highdriving power are given.

In addition, since device resistance is reduced as the processgeneration advances and a reduction in area is promoted, it becomesimportant to improve the performance of the electrostatic dischargeprotection element (the ESD protection element) and various systems areproposed in order to improve the performance (see, for example, JapaneseUnexamined Patent Publication No. 2006-121007.

SUMMARY OF THE INVENTION

However, although the technology described in Japanese Unexamined PatentPublication No. 2006-121007 discloses the ESD protection elementconfigured by an RC time constant and an inverter, it is necessary toset values of a resistive element R and a capacitive element Ccomparatively high in order to drive the inverter while an ESD currentis being released. Consequently, value setting of the resistance elementR and the capacitive element C is left as a subject matter to be solvedin order to promote area reduction.

The present disclosure has been made in view of the above-mentionedcircumstance and aims to provide a semiconductor device making itpossible to promote area reduction while maintaining the ESD resistance.

Other subject matters and novel features of the present disclosure willbe apparent from the description of the present specification and theappended drawings.

According to one embodiment of the present disclosure, there is provideda semiconductor device which includes a power wire, a ground wire and aprotection circuit provided between the power wire and the ground wireso as to cope with electrostatic discharge. The protection circuitincludes a first transistor coupled between the power wire and theground wire, a first resistive element coupled between the power wireand the ground wire in series with the first transistor, a secondtransistor coupled between the power wire and the ground wire inparallel with the first transistor so as to form a current mirrorcircuit together with the first transistor with a gate of which a firstcoupling node between the first transistor and the first resistiveelement is coupled, a first capacitive element coupled between the powerwire and the ground wire in series with the second transistor, a firstinverter with which a second coupling node between the second transistorand the first capacitive element is coupled as an input node, and aprotection transistor which is coupled between the power wire and theground wire and a gate of which receives an output from the firstinverter. A gate width of the second transistor is narrower than a gatewidth of the first transistor.

According to embodiments of the present disclosure, it is possible topromote area reduction while maintaining the ESD resistance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory diagram illustrating one example of the entireof a semiconductor device 1 according to a First Embodiment.

FIG. 2 is an explanatory diagram illustrating one example of a circuitconfiguration of an I/O cell 500 according to the First Embodiment.

FIG. 3 is an explanatory diagram illustrating one example of a circuitconfiguration of a power supply cell 600 according to the FirstEmbodiment.

FIG. 4 is an explanatory diagram illustrating one example of transitionof each node and a power wire VM when the ESD current has been flowninto each node and the power wire.

FIG. 5A is an explanatory diagram illustrating one example of aprotection circuit of a comparative example.

FIG. 5B is an explanatory diagram illustrating one example of theprotection circuit of the comparative example.

FIG. 5C is an explanatory diagram illustrating one example of theprotection circuit of the comparative example.

FIG. 6 is a diagram illustrating one example of comparison in layoutbetween the protection circuit of the comparative example and the powersupply cell 600 according to the First Embodiment.

FIG. 7 is an explanatory diagram illustrating one example of a layoutconfiguration of a current mirror circuit of the power supply cell 600according to the First Embodiment.

FIG. 8 is an explanatory diagram illustrating one example of a layoutconfiguration of a resistive element of the power supply cell 600according to the First Embodiment.

FIG. 9 is an explanatory diagram illustrating one example of a circuitconfiguration of a power supply cell 600A according to a modifiedexample of the First Embodiment.

FIG. 10A is an explanatory diagram illustrating one example of a powersupply cell 600B according to a Second Embodiment.

FIG. 10B is an explanatory diagram illustrating one example of the powersupply cell 600B according to the Second Embodiment.

FIG. 11A is an explanatory diagram illustrating one example of a circuitconfiguration of one power supply cell according to one modified exampleof the Second Embodiment.

FIG. 11B is an explanatory diagram illustrating one example of a circuitconfiguration of another power supply cell according to another modifiedexample of the Second Embodiment.

FIG. 12A is an explanatory diagram illustrating one example of a circuitconfiguration of a power supply cell according to a Third Embodiment.

FIG. 12B is an explanatory diagram illustrating one example of a circuitconfiguration of a power supply cell according to a modified example ofthe Third Embodiment.

DETAILED DESCRIPTION

Preferred embodiments of the present disclosure will be described indetail with reference to the drawings. Incidentally, the same numeralsare assigned to the same or corresponding parts in the drawing a and thedescription thereof is omitted. In addition, in the embodiments of thepresent disclosure, the semiconductor device means any of asemiconductor wafer formed by integration of electronic circuits, eachsemiconductor chip formed by dicing the semiconductor wafer into chipsand the one formed by packaging one semiconductor chip or a pluralitryof the semiconductor chips with resin and so forth.

First Embodiment

FIG. 1 is an explanatory diagram illustrating one example of the entireof the semiconductor device 1 according to a First Embodiment.

As illustrated in FIG. 1, the semiconductor device 1 includes acircumferential I/O region 4 which is provided in an outer peripheralregion and a core logic region 2 which is arranged in an internal regionand is configured as an ASIC (application specific integrated circuit)having a predetermined function.

The circumferential I/O region 4 includes the I/O cell 500 serving as aninput/output interface for a signal, the power supply cell 600 whichreceives an input from an external power supply and so forth. Here, acase where the power wire VM and a ground wire GM are arranged in theouter peripheral region is illustrated. A pad VP is a pad for powersupply and a pad GP is a pad for grounding and the pads MP and GP arecoupled with the power supply cell 600. A pad SP is a pad for signal andis coupled with the I/O cell 500. Incidentally, the pads VP, GP and SPare provided along an outer peripheral side of the semiconductor device1 in FIG. 1.

FIG. 2 is an explanatory diagram illustrating one example of a circuitconfiguration of the I/O cell 500 according to the First Embodiment. Asillustrated in FIG. 2, the I/O cell 500 includes protection diodes D1and D2, a P channel MOS transistor 502, an N channel MOS transistor 506,drivers 504 and 508, a resistor 510, an input/output circuit 520 and soforth.

The signal pad SP is coupled with a node N4. The protection diode D1 isprovided between the node N4 and the power wire VM. The protection diodeD1 is coupled with the node N4 on the anode side and is coupled with thepower wire VM on the cathode side. Here, the signal pad SP serves as aninput/output pad and it is possible for the signal pad to receive aninput signal and to output an output signal.

The protection diode D2 is provided between the node N4 and the groundwire GM. The protection diode D2 is coupled with the ground wire GM onthe anode side and is coupled with the node N4 on the cathode side. Theresistor 510 is provided between the node N4 and an input circuit 522.

The P channel MOS transistor 502 is provided in parallel with theprotection diode D1 and is coupled in series between the node N4 and thepower wire VM via the resistor 510. The P channel MOS transistor 502receives an input signal from the driver 504. Incidentally, the drivers504 and 508 each includes an even number of later described invertersand the power is supplied to the drivers 504 and 508 respectivelythrough the power wire VM and the ground wire GM.

The N channel MOS transistor 506 is provided in parallel with theprotection diode D2 and is coupled in series between the node N4 and theground wire GM via the resistor 510. The N channel MOS transistor 506receives an input signal from the driver 508.

The input/output circuit 520 is provided between the power wire VM andthe ground wire GM. The input/output circuit 520 includes an outputlogic circuit 521 which drives the drivers 504 and 508, the inputcircuit 522 which processes the input signal which is sent from the padSP via the resister 510 and a level shifter 523 which boosts(steps-up)/bucks (steps-down) the level of each signal.

Any one of the drivers 504 and 508 operates in accordance with a signalfrom the output logic circuit 521. Then, the P channel MOS transistor502 or the N channel MOS transistor 506 conducts and the signal isoutput from the signal pad SP.

FIG. 3 is an explanatory diagram illustrating one example of a circuitconfiguration of the power supply cell 600 according to the FirstEmbodiment. As illustrated in FIG. 3, the power supply cell 600 includesan N channel MOS transistor 604, an inverter 603, resistive elements 602and 609, a capacitive element 610, P channel MOS transistors 606, 607and 608, an N channel MOS transistor 611 and so forth which configure apower clamp circuit (a protection circuit). A diode 601 is a parasiticdiode of the N channel MOS transistor 604.

The diode 601 is coupled with the ground wire GM on the anode side andis coupled with the power wire VM on the cathode side.

The N channel MOS transistor 604 is coupled between the power wire VMand the ground wire GM and a gate of the N channel MOS transistor 604 iscoupled with an output node N2 of the inverter 603.

The P channel MOS transistor 606 is coupled between the power wire VMand the ground wire GM in series with a resistive element 609 and an Nchannel MOS transistor 611.

The P channel MOS transistor 606 is provided between the power wire VMand a node N0 and a gate of the P channel MOS transistor 606 is coupledwith the node N0. The resistive element 609 is coupled in series withthe P channel MOS transistor 606, is coupled with the node N0 on one endside and is coupled with the N channel MOS transistor 611 on the otherend side. The N channel MOS transistor 611 is coupled between theresistive element 609 and the ground wire GM and a gate of the N channelMOS transistor 611 is coupled with the output node N2.

The P channel MOS transistor 607 is provided between the power wire VMand a node N1 so as to form a current mirror circuit together with the Pchannel MOS transistor 606 and a gate of the P channel MOS transistor607 is coupled with the node N0. The capacitive element 610 is coupledbetween the power wire VM and the ground wire GM in series with the Pchannel MOS transistor 607 via the node N1.

The inverter 603 outputs an inversion signal of a signal from the nodeN1 to the node N2 by using the node N1 as its input side. Incidentally,although a power supply of the inverter 603 is not illustrated, thepower is supplied to the inverter 603 through the power wire VM and theground wire GM and the same also applies to other embodiments.

The resistive element 602 is coupled between the node N2 and the groundwire GM. Since an output from the inverter 603 is pulled down to theground wire GM via the resistive element 602, it is possible to suppressa fluctuation in level of an input into a gate of the N channel MOStransistor 604 when the level of an output from the inverter 603 hasundesirably fluctuated.

The N channel MOS transistor 611 functions as an element which activatesthe current mirror circuit which is configured by the P channel MOStransistors 606 and 607, the resistive element 609 and so forth. Thecurrent mirror circuit is activated by turning the N channel MOStransistor 611 ON. On the other hand, when the N channel MOS transistor611 is in an OFF state, the current mirror circuit is in an inactivatedstate. Here, activation of the current mirror circuit means to flowcurrent to the transistors which configure the current mirror circuit tooperate the current mirror circuit and the same also applies to otherembodiments.

The P channel MOS transistor 608 is coupled between the power wire VMand the node N1 in parallel with the P channel MOS transistor 607 and agate of the P channel MOS transistor 608 is coupled with the output nodeN2. The P channel MOS transistor 608 operates complementarily to the Nchannel MOS transistor 611. That is, when the N channel MOS transistor611 is in an ON state, the P channel MOS transistor 608 is in the OFFstate. On the other hand, in case of a steady state where the N channelMOS transistor 611 is in the OFF state, the P channel MOS transistor 608is turned ON and couples the power wire VM with the node N1 so as tomake it possible to suppress undesirable level fluctuation of the nodeN1.

Incidentally, although, here, the configuration of the power clampcircuit has been described as one example of the power supply cell 600,the power supply cell 610 may be configured as another circuit notlimited to the power clamp circuit.

Here, a case where the ESD current is flowed into (applied to) the padVP will be described. In the steady state, the level (of the potential)of the output node N2 of the inverter 603 is set to an “L” level.Accordingly, the N channel MOS transistor 604 is in the OFF state. Inaddition, the P channel MOS transistor 608 is in the ON state. Since thelevel of the output node N2 is at the “L” level, the N channel MOStransistor 611 is in the OFF state and the current mirror circuit is inthe inactivated state.

On the other hand, when a high voltage generated owing to application ofthe ESD current is applied to the pad VP, the level of the power wire VMis directly changed following high voltage application. A potentialdifference (Vgs) is temporarily generated between a gate and a source ofa P channel MOS transistor which configures the inverter 603 withchanging the level of the power wire VM and the P channel MOS transistoris turned ON. Thereby, the level of the output node N2 is temporarilychanged from the “L” level to an “H” level.

The N channel MOS transistor 604 is brought into the ON state withchanging a gate potential of the output node N2 and the high voltage inthe power wire VM is released into the ground wire GM.

In addition, the P channel MOS transistor 608 is turned OFF withchanging the level of the output node N2 to the “H” level. In addition,the N channel MOS transistor 611 is turned ON and the current mirrorcircuit comes to operate.

Current flows from the power wire VM into the capacitive element 610which is coupled with the node N1 via the P channel MOS transistor 607with activation of the current mirror circuit. In that occasion, thelevel of the node N1 is changed and increased while being delayed inaccordance with a time constant. Then, when the potential at the node N1has exceeded a threshold value of the inverter 603, the N channel MOStransistor of the inverter 603 is turned ON. Thereby, the level of theoutput node N2 again shifts to the “L” level.

The N channel MOS transistor 604 is brought into the OFF state withchanging the gate potential of the output node N2 and current outflowfrom the power wire VM toward the ground wire GM is stopped. Inaddition, the N channel MOS transistor 611 is turned OFF and the currentmirror circuit is inactivated. In addition, the P channel MOS transistor608 is turned ON and the node N1 and the power wire VM are electricallycoupled together. Thereby, the circuit again returns to the steadystate.

FIG. 4 is an explanatory diagram illustrating one example of transitionof each node and the power wire VM when the ESD current has been flowninto each node and the power wire VM.

As illustrated in FIG. 4, the level of the output node N2 is temporarilychanged from the “L” level to the “H” level. Thereby, the N channel MOStransistor 604 is turned ON and the ESD current flows toward the groundwire GM side.

The P channel MOS transistor 608 begins turning ON at a timing PA.Thereby, the potential of the node N1 begins gradually increasing.

Then, the N channel MOS transistor 604 is gain turned OFF by changingthe level of the output node N2 to the “L” level. Thereby, a currentpath from the power wire VM to the ground wire GM is shut off.

The protection circuit of the power supply cell 600 according to theFirst Embodiment is of a system that an amount of current flowing intothe P channel MOS transistor 607 is adjusted by the current mirrorcircuit. Specifically, gate widths of the resistive element 609 and theP channel MOS transistor 607 are adjusted. As one example, the gatewidth of the P channel MOS transistor 607 is set to 1/N (N: 2 or more)the gate width of the P channel MOS transistor 606. It becomes possibleto set the amount of current flowing into the P channel MOS transistor607 to 1/N the amount of current flowing into the P channel MOStransistor 606 by setting the gate width of the P channel MOS transistor607 to 1/N the gate width of the P channel MOS transistor 606.

In the example illustrated in FIG. 4, the amount of current which flowsthrough the P channel MOS transistor 606 of the current mirror circuitis adjusted and the gate width of the P channel MOS transistor 607 isadjusted on the basis of the state of the resistive element 609, andthereby the amount of current which flows into the P channel MOStransistor 607 is adjusted. Thereby, it becomes possible to set aresistance value of the resistive element 609 small. It becomes possibleto reduce an area of the circuit by setting the resistance value of theresistive element 609 small. In the following, description will be madeon the above-mentioned point.

FIG. 5A, FIG. 5B and FIG. 5C are explanatory diagrams each illustratingone example of a configuration of a protection circuit according to acomparative example. FIG. 5A is the explanatory diagram illustrating oneexample of the configuration of the protection circuit. As illustratedin FIG. 5A, a power clamp circuit (the protection circuit) of thecomparative example includes an N channel MOS transistor 604#, aninverter 603#, resistive elements 602# and 609H and a capacitive element610#. A diode 601# is a parasitic diode of the N channel MOS transistor604#. In addition, a power supply pad VP# and a ground pad GP# arerespectively coupled to the power wire VM and the ground wire GM.

Here, a case where the ESD current is flown into (applied to) the padVP# will be described. In the steady state, the level of an output nodeN2# of the inverter 603# is set to the “L” level. Accordingly, the Nchannel MOS transistor 604# is in the OFF state.

On the other hand, when the high voltage generated owing to applicationof the ESD current is applied to the pad VP#, the level of the powerwire VM is directly changed following high voltage application. Thepotential difference (Vgs) is temporarily generated between a gate and asource of a P channel MOS transistor which configures the inverter 603#with changing the level of the power wire VM and the P channel MOStransistor is turned ON. Thereby, the level of the output node N2# istemporarily changed from the “L” level to the “H” level.

The N channel MOS transistor 604# is brought into the ON state withchanging the gate potential of the output node N2# and the high voltagein the power wire VM is released into the ground wire GM.

On the other hand, current flows into the capacitive element 610# whichis coupled with a node N1# via the resistive element 609#. In thatoccasion, the level of the N1# is increased while being delayed inaccordance with an RC time constant of the resistive element 609# andthe capacitive element 610#. Then, when the potential of the node N1#has exceeded a threshold value of the inverter 603#, an N channel MOStransistor of the inverter 603# is turned ON. Thereby, the level of theoutput node N2# again shifts to the “L” level.

Thereby, the circuit again returns to the steady state. FIG. 5B is theexplanatory diagram illustrating one example of a change in RC timeconstant.

A waveform obtained when electric charge is charged into the capacitiveelement 610# is illustrated in FIG. 5B.

Here, a voltage V is expressed as voltage V=VCCQ (1−e−^(t/RC)). Thisformula is deformed to t=−1oge^((V/VCCQ))*RC. Then, RC is expressed asRC=−t/1oge^((V/VCCQ)). Here, for example, the threshold value of theinverter 603# to be coupled to an RC time constant circuit is set toabout 0.5*VCCQ (V/VCCQ=about 0.5) and a necessary time t is set to about0.5 μs.

Then, RC=−1 μs/1oge^((0.5))=about 0.77*10⁻⁶ is obtained. If acapacitance value C of the capacitive element 610# is 1 pF, about 770 kΩwill be necessary as a resistance value R of the resistive element 609#.

Accordingly, since the capacitance value C of the capacitive element610# and the resistance value R of the resistive element 609# amount toconsiderably high values, the layout area when designing the capacitiveelement 610 and the resistive element 609 is increased.

FIG. 5C schematically illustrates one example of an area ratio that theprotection circuit occupies when laying out the protection circuit.

Here, when the capacitive element 610# of the capacitance value C=1 pFis to be designed with MOS capacitors, about 60 or more capacitors arenecessary in case of a MOS transistor having the gate width of about 5μm and the gate length of about 0.55 μm.

In addition, when the resistive element 609# of the resistance valueR=about 770 kΩ is to be designed with polysilicon resistors, it becomesnecessary to serially couple about 25 or more resistors in case of apolysilicon resistor having the gate width of about 0.4 μm and the gatelength of about 24 μm respectively. Accordingly, as illustrated in FIG.5C, the area ratio that the capacitive element 610# and the resistanceelement 609# occupy becomes considerably high.

On the other hand, the protection circuit of the power supply cell 600according to the present First Embodiment is of the system that theamount of current flowing into the P channel MOS transistor 607 isadjusted by the current mirror circuit as described above.

Here, a case where the capacitive element 610 is designed with the samecapacity value as that of the capacitive element 610# will beconsidered. Then, a case where the same amount of current as that of thecapacitive element 610# is supplied to the capacitive element 610 willbe considered.

In the configuration of the protection circuit in the comparativeexample, it is necessary to set the resistance value of the resistiveelement 609# high so as to reduce the amount of current to be suppliedto the capacitive element. While, in the system according to the presentFirst Embodiment, it is possible to reduce the current amount byadjusting the gate width of the P channel MOS transistor 607.

Specifically, the gate width of the P channel MOS transistor 607 is setto about 1/N (N: 2 or more) the gate width of the P channel MOStransistor 606.

Accordingly, the current flowing into the P channel MOS transistor 606of the current mirror circuit is set to N times the current flowing intothe P channel MOS transistor 607.

Thereby, it is possible to set the resistance value of the resistiveelement 609 to be coupled to the P channel MOS transistor 607 is set to1/N the resistance value R of the resistive element 609#.

FIG. 6 is a diagram illustrating one example of comparison in layoutbetween the protection circuit of the comparative example and the powersupply cell 600 according to the First Embodiment.

As illustrated in FIG. 6, since it is possible to reduce the resistancevalue of the resistive element 609 owing to the above-mentionedconfiguration, it is possible to reduce the layout area of thepolysilicon resistor which forms the resistive element 609 and therebyit is possible to reduce the layout area of the entire protectioncircuit more than the layout area of the configuration of thecomparative example.

FIG. 7 is an explanatory diagram illustrating one example of a layoutconfiguration of the current mirror circuit of the power supply cell 600according to the First Embodiment.

A case where N P channel MOS transistors are adjacently providedrelative to one P channel MOS transistor 607 which configures thecurrent mirror circuit is illustrated in FIG. 7.

Each transistor includes a gate electrode, a source electrode, a drainelectrode, a diffusion layer DF and so forth. In addition, the gateelectrode is provided between the source electrode and the drainelectrode.

The source electrode of each transistor is coupled to the power wire VMand the drain electrode of each transistor is coupled to the resistor609.

The source electrode and the drain electrode of each transistor areformed in a metal layer M2 which is the second layer configuring eachtransistor. The metal layer M2 is coupled with the diffusion layer DFthrough a contact hole CT.

The gate electrodes of the respective transistors are commonly coupledto a metal layer M1 which is the first layer. Gates on the both ends ofeach gate electrode are dummy gates and the dummy gates are not used forformation of the transistor.

The metal layer M2 which forms the drain electrode provided between thegate which forms the transistor 607 and the dummy gate is coupled to acapacitor 610. The dummy gate is also coupled to the power wire VMthrough the contact hole CT.

In addition, the metal layer M1 to be coupled with the gate electrode iscoupled with the metal layer M2 which forms the drain electrode throughthe contact hole CT. Incidentally, although a plurality of the contactholes CT are present in each electrode, one or two contact hole(s)is/are illustrated in FIG. 7 and illustration of the remaining contactholes CT is omitted.

FIG. 8 is an explanatory diagram illustrating one example of a layoutconfiguration of the resistive element of the power supply cell 600according to the First Embodiment.

In FIG. 8, as the layout configuration of the resistive element 609 (thepolysilicon resistor), sub-elements of the resistive element 609 arecoupled in series with one another via the contact holes CT and themetal layers M1 into the folded form. Here, the above-described gatewidth W and gate length L are illustrated.

Incidentally, although in the First Embodiment, a case where thecapacitive element 610 is designed with the same capacity value as thatof the capacitive element 610# has been described by way of example, thepresent disclosure is not limited to the case and the capacity value ofthe capacitive element 610 may be further reduced by adjusting the gatewidth of the P channel MOS transistor 607 so as to reduce the amount ofcurrent. Thereby, it is possible to further reduce the layout area ofthe entire protection circuit by further reducing the ratio that the MOScapacitors of the capacitive element 610 occupy. Incidentally, the samealso applies to the following embodiments.

Incidentally, although in the First Embodiment, the configuration thatthe gate width is adjusted as the size of the P channel MOS transistor607 so as to reduce the current amount has been described, the size tobe reduced is not limited to the gate width and the gate length may beadjusted so as to reduce the current amount. For example, the gatelength of the P channel MOS transistor 607 is set longer than the gatelength of the P channel MOS transistor 606 by way of example. It ispossible to more reduce the amount of current flowing into the P channelMOS transistor 607 than the amount of current flowing into the P channelMOS transistor 606 by setting the gate length of the P channel MOStransistor 607 longer than the gate length of the P channel MOStransistor 606.

MODIFIED EXAMPLE

FIG. 9 is an explanatory diagram illustrating one example of a circuitconfiguration of a power supply cell 600A according to a modifiedexample of the First Embodiment.

As illustrated in FIG. 9, the power supply cell 600A is of aconfiguration that a function of controlling a back gate of the Nchannel MOS transistor 604 is added in comparison with the power supplycell 600.

Specifically, the power supply cell 600A is different from the powersupply cell 600 in that an inverter 603A has been provided between thenode N1 and the back gate of the N channel MOS transistor 604 and aresistive element 602A has been added between an output node of theinverter 603A and the ground wire GM. Other configurations are the sameas those of the First Embodiment and therefore detailed descriptionthereof is omitted.

The resistive element 602A is coupled between the output node of theinverter 603A and the ground wire GM. Since an output from the inverter603A is pulled down to the ground wire GM via the resistive element602A, it is possible to suppress fluctuation of an input into the backgate region (the well region) when the output from the inverter 603A hasundesirably fluctuated.

A parasitic diode 605 is formed on a junction between the back gateregion (the well region) and a source of the N channel MOS transistor604. There is the possibility that the level of a gate input when the Nchannel MOS transistor 604 is to be turned ON may be lowered by theamount of a forward voltage (VF) of the parasitic diode 605 due to theaction of the parasitic diode 605 and it may become difficult to fullyswing the gate input into the N channel MOS transistor 604.

Therefore, it becomes possible to fully swing the gate input when the Nchannel MOS transistor 604 is to be turned ON by preforming gate inputinto the N channel MOS transistor 604 and biasing of the back gateregion (the well region) of the N channel MOS transistor 604 by mutuallydifferent inverters 603 and 603A. Thereby, it is possible to promotespeeding-up of ESD current discharge of the N channel MOS transistor604.

Incidentally, in the modified example in FIG. 9, although theconfiguration that the N channel MOS transistor 611 which activates thecurrent mirror circuit and the P channel MOS transistor 608 whichoperates complementarily to the N channel MOS transistor 611 are usedhas been described, a configuration with no provision of suchtransistors as mentioned above is also possible.

Second Embodiment

In a Second Embodiment, a system configured to further improve the ESDdischarge characteristic will be described.

FIG. 10A and FIG. 10B are explanatory diagrams each illustrating oneexample of a circuit configuration of a power supply cell 600B accordingto the Second Embodiment. FIG. 10A is the explanatory diagram of oneexample of the circuit configuration of the power supply cell 600B.

As illustrated in FIG. 10A, the power supply cell 600B is different fromthe power supply cell 600A in that an inverter 620 and a resistiveelement 621 have been further provided.

-   -   The inverter 620 outputs a signal to a node N3 with the node N1        being used as an input node. A gate of the P channel MOS        transistor 608 is coupled with the node N3. In addition, the N        channel MOS transistor 611 is coupled with node N3.        The resistive element 621 is coupled between the node N3 and the        ground wire GM. The power supply cell 600B is different from the        power supply cell 600A in that the gates of the P channel MOS        transistor 608 and the N channel MOS transistor 611 receive not        the output from the inverter 603 but the output from the        inverter 620.

Since other configurations and operations are the same as those of thepower supply cell 600A, detailed description thereof is omitted. FIG.10B is the explanatory diagram illustrating one example of transition ofeach node and the power wire VM when the ESD current has been flown intoeach node and the power wire VM.

As illustrated in FIG. 10B, the level of the output node N2 istemporarily changed from the “L” level to the “H” level. Thereby, the Nchannel MOS transistor 604 is turned ON and the ESD current flows towardthe ground wire GM side.

The P channel MOS transistor 608 beings turning ON at the timing PA andthereby the potential of the node N1 beings gradually increasing.

Then, the level of the output node N2 is changed to the “L” level andthereby the N channel MOS transistor 604 is again turned OFF. Thereby,the current path from the power wire VM to the ground wire GM is shutoff.

In the example in FIG. 4, since the output node N2 of the inverter 603is coupled to the gate of the N channel MOS transistor 608, the Pchannel MOS transistor 608 begins turning ON after the timing PA.Thereby, potential increasing of the node N1 is accelerated.

On the other hand, in the example illustrated in FIG. 10B, the P channelMOS transistor 608 is turned ON at a timing PB that the potential of thenode N1 has been sufficiently increased.

Accordingly, early increasing of the potential of the node N1 issuppressed by delaying a timing that the P channel MOS transistor 608 isturned ON and thereby it is possible to delay a time that the gatepotential of the N channel MOS transistor 604 is set to the “L” level.Thereby, the ON time of the N channel MOS transistor 604 is increasedwithout increasing the values of the resistive element 609 and thecapacitive element 610, and thereby it becomes possible to furtherimprove the ESD discharge characteristic and it becomes also possible toreduce the layout area.

Modified Examples of Second Embodiment

FIG. 11A and FIG. 11B are explanatory diagrams each illustrating oneexample of a circuit configuration of a power supply cell according to amodified example of the Second Embodiment.

FIG. 11A is an explanatory diagram illustrating one example of thecircuit configuration of a power supply cell 600C. As illustrated inFIG. 11A, the power supply cell 600C is different from the power supplycell 600B in that a P channel MOS transistor 630 has been provided inplace of the inverter 620. Other configurations are the same as those ofthe power supply cell 600B.

That is, the power supply cell 600C is of a configuration that the Nchannel MOS transistor which configures the inverter 620 has beendeleted. The configuration is of the type that potential decreasing ofthe node N3 caused by provision of the N channel MOS transistor has beeneliminated. Elimination of the N channel MOS transistor makes itdifficult to decrease the potential of the node N3 and thereby itbecomes possible to delay the timing that the P channel MOS transistor608 is turned ON.

Thereby, early increasing of the potential of the node N1 is suppressedand thereby it becomes possible to delay the time that the gatepotential of the N channel MOS transistor 604 is set to the “L” level.Thereby, the ON time of the N channel MOS transistor 604 is increasedwithout increasing the values of the resistance element 609 and thecapacitive element 610, and thereby it becomes possible to furtherimprove the ESD discharge characteristic and it becomes also possible toreduce the layout area.

FIG. 11B is the explanatory diagram illustrating one example of acircuit configuration of a power supply cell 600D. As illustrated inFIG. 11B, the power supply cell 600D is different from the power supplycell 600B in that the resistive element 621 has been deleted. Otherconfigurations are the same as those of the power supply cell 600B.

That is, it is made difficult to decrease the potential of the node N3by deleting the resistive element 621 and thereby it becomes possible todelay the timing that the P channel MOS transistor 608 is turned ON.

Thereby, early increasing of the potential of the node N1 is suppressedand thereby it is possible to delay the time that the gate potential ofthe N channel MOS transistor 604 is set to the “L” level. Thereby, theON time of the N channel MOS transistor 604 is increased withoutincreasing the values of the resistance element 609 and the capacitiveelement 610, and thereby it becomes possible to further improve the ESDdischarge characteristic and it becomes also possible to reduce thelayout area.

Third Embodiment

FIG. 12A and FIG. 12B are explanatory diagrams each illustrating oneexample of a circuit configuration of a power supply cell according to aThird Embodiment.

FIG. 12A is the explanatory diagram illustrating one example of acircuit configuration of a power supply cell 700. As illustrated in FIG.12A, the power supply cell 700 is different from the power supply cell600 in that the current mirror circuit is formed by N channel MOStransistors.

Specifically, the power supply cell 700 is different from the powersupply cell 600 in that N channel MOS transistors 706, 707 and 708 havebeen provided in place of the P channel MOS transistors 606, 607 and608, a P channel MOS transistor 711 has been provided in place of the Nchannel MOS transistor 611 and further an inverter 712 has been added.

Specifically, the N channel MOS transistor 706 is coupled in series withthe resistive element 609 and the P channel MOS transistor 711 betweenthe power wire VM and the ground wire GM.

The N channel MOS transistor 706 is provided between the ground wire GMand the node N3 and a gate thereof is coupled with the node N3. Theresistive element 609 is coupled in series with the N channel MOStransistor 706, is coupled with the node N3 on the one end side thereofand is coupled with the P channel MOS transistor 711 on the other endside thereof. The P channel MOS transistor 711 is coupled between theresistive element 609 and the power wire VM and a gate thereof iscoupled with a node N5.

The inverter 712 is coupled with the node N4 on the input side thereofand outputs a signal to the node N5. The N channel MOS transistor 707 isprovided between the ground wire GM and the node N4 so as to form acurrent mirror circuit together with the N channel MOS transistor 706and a gate thereof is coupled with the node N3.

The capacitive element 610 is coupled in series with the N channel MOStransistor 707 via the node N4 between the power wire VM and the groundwire GM.

The inverter 603 outputs an inversion signal of a signal input into thenode N5 to the output node N2 with the node N5 being set as its inputside.

The P channel MOS transistor 711 functions as an element which activatesthe current mirror circuit configured by the N channel MOS transistors706 and 707 and the resistive element 609. The current mirror circuit isactivated by turning the P channel MOS transistor 711 ON. On the otherhand, when the P channel MOS transistor 711 is in the OFF state, thecurrent mirror circuit is an inactivated state.

The N channel MOS transistor 708 is coupled in parallel with the Nchannel MOS transistor 707 between the ground wire GM and the node N4and a gate thereof is coupled with the node N5. The N channel MOStransistor 708 operates complementarily to the P channel MOS transistor711. That is, when the P channel MOS transistor 711 is in the ON state,the N channel MOS transistor 708 is in the OFF state. On the other hand,in the steady state where the P channel MOS transistor 711 is in the OFFstate, the N channel MOS transistor 708 is turned ON to couple theground wire GM with the node N4 to make it possible to suppressundesirable level fluctuation of the node N4.

Incidentally, although, here, the configuration of the power clampcircuit has been described as one example of the power supply cell 700,the power supply cell 700 is not limited to the power clamp circuit andmay configure another circuit.

Here, a case where the ESD current is flown into (applied to) the pad VPwill be described. The level of the node N4 is set to the “L” level inthe steady state. The level of the node N5 which is provided with theinverter 712 interposed is set to the “H” level. Accordingly, the Nchannel MOS transistor 708 is in the ON state. In addition, since thelevel of the node N5 is set to the “H” level, the level of the outputnode N2 of the inverter 603 is set to the “L” level. Accordingly, the Nchannel MOS transistor 604 is in the OFF state.

Since the level of the node N5 is set to the “H” level, the P channelMOS transistor 711 is in the OFF state and the current mirror circuit isin the inactivated state.

On the other hand, when the high voltage generated owing to applicationof the ESD current is applied to the pad VP, the level of the power wireVM is directly changed following high voltage application. The potentialdifference (Vgs) is temporarily generated between the gate and thesource of the P channel MOS transistor which configures the inverter 603with changing the level of the power wire VM and the P channel MOStransistor is turned ON. Thereby, the level of the output node N2 istemporarily changed from the “L” level to an “H” level. The N channelMOS transistor 604 is brought into the ON state with changing the gatepotential of the output node N2 and the high voltage in the power wireVM is released into the ground wire GM.

In addition, the N channel MOS transistor 708 is turned OFF withchanging the level of the output node N5 from the “H” level to the “L”level. In addition, the P channel MOS transistor 711 is turned ON andthe current mirror circuit comes to operate.

Current flows from the node N4 toward the ground wire GM via the Nchannel MOS transistor 707 with activation of the current mirrorcircuit. In that occasion, the level of the node N1 is changed anddecreased while being delayed in accordance with the time constant.Then, when the potential of the node N4 has exceeded a threshold valueof the inverter 712, the level of the node N5 is set to the “H” leveland the N channel MOS transistor of the inverter 603 is turned ON.Thereby, the level of the potential of the output node N2 again shiftsto the “L” level.

The N channel MOS transistor 604 is brought into the OFF state withchanging the gate potential of the output node N2 and current outflowfrom the power wire VM into the ground wire GM is stopped. In addition,the P channel MOS transistor 711 is turned OFF and the current mirrorcircuit is inactivated. In addition, the N channel MOS transistor 708 isturned ON and the node N1 and the power wire VM are electrically coupledtogether. Thereby, the circuit again returns to the steady state.

In the example illustrated in FIG. 12A, the amount of current flowingthrough the N channel MOS transistor 706 of the current mirror circuitis adjusted and the gate width of the N channel MOS transistor 707 isadjusted on the basis of the state of the resistive element 609, andthereby the amount of current flowing into the N channel MOS transistor707 is adjusted. Thereby, it becomes possible to set the resistancevalue of the resistive element 609 small as described in the FirstEmbodiment. It becomes possible to reduce the circuit area by settingthe resistance value of the resistive element 609 small.

FIG. 12B is the explanatory diagram illustrating one example of acircuit configuration of a power supply cell 700A according to amodified example of the Third Embodiment.

As illustrated in FIG. 12B, the power supply cell 700A is of aconfiguration that a function of controlling the back gate of the Nchannel MOS transistor 604 has been added in comparison with the powersupply cell 700.

Specifically, the power supply cell 700A is different from the powersupply cell 700 in that the inverter 603A has been provided between thenode N5 and the back gate of the N channel MOS transistor 604 and theresistive element 602A has been added between the output node of theinverter 603A and the ground wire GM. Other configurations are the sameas those of the power supply cell 700 and therefore detailed descriptionthereof is omitted.

The resistive element 602A is coupled between the output node of theinverter 603A and the ground wire GM. Since the output from the inverter603A is pulled down to the ground wire GM via the resistive element602A, it is possible to suppress fluctuation of an input into the backgate region (the well region) when the output from the inverter 603A hasundesirably fluctuated.

The parasitic diode 605 is formed on the junction between the back gateregion (the well region) and the source of the N channel MOS transistor604. There is the possibility that the level of the gate input when theN channel MOS transistor 604 is to be turned ON may be lowered by theamount of the forward voltage (VF) of the parasitic diode 605 due to theaction of the parasitic diode 605 and it may become difficult to fullyswing the gate input into the N channel MOS transistor 604.

Therefore, it is possible to fully swing the gate input when the Nchannel MOS transistor 604 is to be turned ON by preforming gate inputinto the N channel MOS transistor 604 and biasing of the back gateregion (the well region) of the N channel MOS transistor 604 by mutuallydifferent inverters 603 and 603A. Thereby, it is possible to promotespeeding-up of the ESD current discharge of the N channel MOS transistor604.

Since even when the current mirror circuit is configured by the Nchannel MOS transistors, it becomes possible to decrease the resistancevalue of the resistance element 609 as in the case in the FirstEmbodiment, it becomes possible to more reduce the layout area of theentire protection circuit than the configuration of the comparativeexample by reducing the layout area of the polysilicon resistor whichforms the resistive element 609.

Although, in the foregoing, the present disclosure has been describedspecifically on the basis of the preferred embodiments, it goes withoutsaying that the present disclosure is not limited to the above-mentionedembodiments and may be modified in a variety of ways within a range notdeviating from the gist of the present disclosure.

What is claimed is:
 1. A semiconductor device, comprising: a power wire;a ground wire; and a protection circuit provided between the power wireand the ground wire, wherein the protection circuit comprises: a firstcurrent mirror circuit coupled between the power wire and the groundwire, a first capacitive element coupled between the power wire and theground wire in series with the current mirror circuit, a first inverterwith which a first coupling node between the current mirror circuit andthe first capacitive element is coupled as an input node, and aprotection transistor which is coupled between the power wire and theground wire and a gate of which receives an output from the firstinverter.
 2. The semiconductor device according to claim 1, the currentmirror circuit comprises: a first transistor coupled between the powerwire and the ground wire, and a second transistor coupled between thepower wire and the ground wire in parallel with the first transistor soas to form a current mirror circuit together with the first transistor,wherein the second transistor is coupled to the capacitive elementthrough the first coupling node.
 3. The semiconductor device accordingto claim 2, wherein the protection circuit comprises a third transistorwhich is coupled between the power wire and the first coupling node inparallel with the second transistor.
 4. The semiconductor deviceaccording to claim 3, wherein the protection circuit further comprises afirst resistive element coupled between the power wire and the groundwire in series with the first transistor.
 5. The semiconductor deviceaccording to claim 4, wherein the protection circuit further comprises afourth transistor which is coupled between the power wire and the groundwire in series with the first resistive element.
 6. The semiconductordevice according to claim 5, wherein a gate of the fourth transistor iscoupled to a gate of the protection transistor so as to operate thecurrent mirror circuit in accordance with an output from the firstinverter.
 7. The semiconductor device according to claim 6, wherein thefourth transistor operates complimentarily with the third transistor. 8.The semiconductor device according to claim 4, wherein the protectioncircuit further comprises a second resistive element coupled between thegate of the third transistor and the ground wire.
 9. The semiconductordevice according to claim 3, wherein the protection circuit furthercomprises a fifth transistor which is coupled between the power wire andthe gate of the third transistor and a gate of which is coupled with asecond coupling node, and a second resistive element which is coupledbetween the gate of the third transistor and the ground wire.
 10. Thesemiconductor device according to claim 4, wherein the first resistiveelement is a polysilicon resistor.
 11. The semiconductor deviceaccording to claim 1, wherein at least one of the power wire and theground wire is coupled with a pad.
 12. The semiconductor deviceaccording to claim 1, further comprising: an input/output circuitcoupled between the power wire and the ground wire in parallel with theprotection circuit.
 13. The semiconductor device according to claim 1,wherein the protection circuit further comprises a second inverter whichis provided in parallel with the first inverter and is adapted tocontrol a back gate of the protection transistor by using the firstcoupling node as an input node.
 14. The semiconductor device accordingto claim 13, wherein the protection circuit further comprises a thirdresistive element which is coupled between the back gate of theprotection transistor and the ground wire.